Our services

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Critical Expertise Gap

Your project enters a critical phase while key technical resources are unavailable or committed elsewhere.

Tape-out schedules often overlap with other projects, product priorities shift, and highly specialized expertise may become temporarily unavailable. Additional senior analog or mixed-signal expertise can help maintain development momentum without permanent headcount increases.

Silicon Does Not Behave as Expected

First silicon, prototype hardware or production measurements reveal unexpected behaviour that cannot be explained immediately.

Differences between simulation and measured performance occur in all complex mixed-signal systems. Resolving these issues often requires a structured investigation across architecture assumptions, circuit implementation, layout effects, packaging, test conditions and application environment.

Architecture Decisions with Long-Term Consequences

A project reaches a point where important architectural decisions must be made with limited opportunity for later correction.

Trade-offs between performance, power consumption, silicon area, cost, technology choice and testability often become visible only when viewed from a broader and unbiased perspective. Independent reviews and additional experience can help reduce technical risk before major implementation effort is committed.

Project growth outpaces available resources

Growing organizations, startups and new product initiatives often experience periods where project complexity or delivery schedules temporarily exceed available internal capacity. Additional expertise can help maintain momentum, support knowledge transfer and reduce pressure on existing teams while longer-term structures continue to develop.

Design expertise across analog and mixed-signal functions commonly used in Sensor Interfaces, Power Management, RF,  Neuromorphic Multiply-Accumulate, Optical and High-Speed SerDes.

Precision analog signal conditioning and amplification, voltage and current references, precision bias.

Sensor front-ends for capacitive, inductive and optical sensing applications.

High speed photodiode TIA frontends for APD-based interfaces, noise/gain/bandwidth/signal integrity/power topics, chip floorplans, high-speed amplifier arrays power routing and decoupling, RF issues, parasitic inductances and resonances.

Timing and synchronization circuits including PLLs, multi-phase VCO with precision phase matching and low jitter and phase noise, Injection Locking, Time-To-Digital conversion, PLL for tracking and frequency/phase demodulation, PLL for clock and data recovery, tuned delay lines, DLL, Frequency Synthesis for RF applications, clock generation.

Data converters including SAR, Flash, Pipeline and Sigma-Delta ADC, Foreground/Background calibration and Redundancy, HV sampling, DAC implementations.

Power management functions including LDO, DC-DC converters loop blocks (e.g. current-voltage sense and feedback analog or ADC channels), Charge Pumps, Diagnostic/Supervision/Functional Safety, Protections.

Technical Due Diligence During Technology Acquisition

Investment, acquisition and licensing decisions often require an independent assessment of technical maturity and risk.

Mixed-signal IP can be difficult to evaluate from specifications and presentations alone. Independent technical review can support the assessment of architecture decisions, design complexity, manufacturability, verification approach and expected development effort prior to strategic commitments.

Root Cause Analysis and Technical Problem Solving

Structured root cause analysis using methodologies including 5 Whys, Fault Tree Analysis (FTA), Fishbone/Ishikawa diagrams, FMEA and 8D problem solving.

Investigation of discrepancies between simulation, silicon characterization, production test and field performance.

Definition and execution of experiments required to isolate root causes and validate corrective actions.

Technical leadership on demand of cross-functional failure analysis activities involving design, test, product engineering, manufacturing and quality organizations.